首页> 外文会议>European Photovoltaic Solar Energy Conference and Exhibition >PILOT LINE PRODUCTION OF INDUSTRIAL HIGH-EFFICIENT BIFACIAL N-TYPE SILICON SOLAR CELLS WITH SELECTIVE BACK SURFACE FIELD PROCESS
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PILOT LINE PRODUCTION OF INDUSTRIAL HIGH-EFFICIENT BIFACIAL N-TYPE SILICON SOLAR CELLS WITH SELECTIVE BACK SURFACE FIELD PROCESS

机译:具有选择性背表面场工艺的工业高效双N型硅太阳能电池的先导生产

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The back side of Bifacial N-type Si solar cells has to be highly doped to form back surface field (BSF), this results in low contact and good fill factor. However, highly doped back surface field increased Auger recombination and high surface recombination. The motivation to form selective back surface field on n-type cells from the selective emitter known for p-type cells. This paper applied two different process to create selective back surface field and developed industrially applicable production sequence. The first one uses commercial etching paste by screen printing to etch the regions between the contact metallization . The second process utilizes the wet chemical etch back process where the areas intended for metallization are protected from etching by an acid resistant barrier. Both techniques attain significant improvement (0.3% _(abs) efficiency gain for etching paste and >0.4% _(abs) for etch back process) compared to standard cells with homogeneous back surface field. The influence of cell parameters and its distribution are discussed, respectively.
机译:双面N型Si太阳能电池的背面必须进行高度掺杂才能形成背面场(BSF),这会导致低接触和良好的填充系数。然而,高掺杂的背面场增加了俄歇重组和高表面重组。从已知的p型电池的选择性发射极在n型电池上形成选择性背面场的动机。本文应用了两种不同的方法来创建选择性的后表面场,并制定了工业上适用的生产顺序。第一种方法是使用商业化的蚀刻膏,通过丝网印刷来蚀刻触点金属化层之间的区域。第二种方法利用了湿法化学回蚀工艺,在该工艺中,用于金属化的区域可以通过抗酸阻挡层进行蚀刻保护。与具有均匀背面场的标准电池相比,这两种技术均获得了显着改善(蚀刻浆料的效率提高了0.3%_(abs),而回蚀工艺的效率提高了> 0.4%_(abs))。分别讨论了单元格参数的影响及其分布。

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