Packaging problem in microelectronics due to stress and fracture at the “metal-ceramic” interface

摘要

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite composite ceramics (AlO - SiO) matrix. Sticking between metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. It was noted that pore clusters were capable of initiating ductile rupture, by means of plastic instability, in the presence of appreciable tri-axiality.