Prediction of near-field shielding effectiveness for conformal-shielded SiP and measurement with magnetic probe

摘要

This paper presents a fast prediction method to evaluate the near-field shielding effectiveness (SE) for conformal-shielded System-in-Packages (SiP). By revising the typical EM method to meet SiP circumstances, the near-field SE can be quickly estimated. A simple conformal-shielded SiP module is designed. To experimentally verify the proposed method, two kinds of metallic shielding materials, copper and nickel, are sputtered on the module with different coating thicknesses. In the near-field, the measured SE reaches up to 52 dB for 4-µm copper coating as well as 54 dB for 15-µm nickel coating. The predicted results are closely agreed with simulations and measurements from 0.01 and 1 GHz.