Laser-based microscale bending for microelectronics fabrication

摘要

This paper presents experimental and theoretical work on laser-based microscale bending. High precision bending of stainless steel and ceramic specimens is achieved with the use of a pulsed or a CW laser. Experiments are conducted to study the bending behavior of stainless steel and ceramics due to laser irradiation. The amount of bending is correlated with various laser and processing parameters. A theoretical model of the laser bending process is presented base don thermo-elasticity/plasticity. The laser bending process is explained as the result of the laser-induced non- uniform distribution of the residual strain. Numerical simulations are carried out to calculate the laser-induced temperature field, the residual stress field, and the amount of bending for both pulsed and CW laser irradiation. Applications of the laser bending technique in microelectronics fabrication are discussed.