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An improved voltage bandgap reference with high-order curvature compensation

机译:具有高阶曲率补偿的改进电压带隙基准

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This paper presents an improved bandgap reference (BGR) with high-order curvature compensation. By adding a second-level operational tranconductance amplifier (OTA) with feedback, fully improve the correctness of hypothesises in paper [3]. In addition, the output voltage reference can be further compensated than the conventional high-order BGR from theoretical analysis and simulation results. Through the comparison and analysis with conventional compensation BGR, the proposed bangap structure has a smaller temperature coefficient of output voltage reference. Finally the simulation results based on 0.1μm CMOS process with 1.5V supply voltage indicate that the temperature coefficient of the proposed reference is 25.5ppm/°C during the temperature range (-30°C~120°C) over different process corners.
机译:本文提出了一种具有高阶曲率补偿的改进的带隙基准(BGR)。通过添加带反馈的二级运算跨导放大器(OTA),可以充分提高论文中假设的正​​确性[3]。此外,从理论分析和仿真结果来看,与常规高阶BGR相比,可以进一步补偿输出电压基准。通过与常规补偿BGR的比较和分析,提出的bangap结构具有较小的输出电压基准温度系数。最后,基于0.1μmCMOS工艺,电源电压为1.5V的仿真结果表明,在不同工艺角的温度范围(-30°C〜120°C)中,所提出参考的温度系数为25.5ppm /°C。

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