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A field-based parasitic capacitance model with 3-D terminal and terminal fringe components

机译:具有3-D端子和端子边缘组件的基于场的寄生电容模型

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In this paper, a parasitic capacitance model for a single three-dimensional (3-D) wire above a plate is developed. The model decomposes electric field into various regions and gives solutions to each part. The total capacitance is the summation of all capacitance parts corresponding to the electric field distribution. The model's physical base minimizes its complexity and error comparing to a traditional empirical fitting process. Verified by extensive COMSOL simulations, the model can accurately predict parasitic capacitance for a wide range of BEOL wire dimensions. Thus, it holds potential to be further investigated for circuit simulation and design.
机译:在本文中,开发了板上方的单条三维(3-D)导线的寄生电容模型。该模型将电场分解为各个区域,并为每个部分提供解决方案。总电容是对应于电场分布的所有电容部分的总和。与传统的经验拟合过程相比,该模型的物理基础将其复杂性和误差降至最低。通过广泛的COMSOL仿真验证,该模型可以准确预测各种BEOL导线尺寸的寄生电容。因此,它具有为电路仿真和设计做进一步研究的潜力。

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