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A gate-oxide-breakdown antifuse OTP ROM array based on TSMC 90nm process

机译:基于台积电90nm工艺的栅极氧化物击穿反熔丝OTP ROM阵列

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A one-time programmable (OTP) antifuse ROM array using MOSFET gate oxide breakdown, which is designed and fabricated under TSMC 90nm standard CMOS process, is presented in this paper. The breakdown voltage and breakdown time are measured. The schematic design of three-transistor antifuse OTP ROM array is exhibited. SPI bus is used to decrease the number of chip pads in practice. The experimental result shows that write & read function can be realized successfully.
机译:本文提出了一种采用MOSFET栅极氧化层击穿的一次性可编程(OTP)反熔丝ROM阵列,该阵列是在TSMC 90nm标准CMOS工艺下设计和制造的。测量击穿电压和击穿时间。展示了三晶体管反熔丝OTP ROM阵列的原理图设计。实际上,使用SPI总线来减少芯片焊盘的数量。实验结果表明,可以成功实现读写功能。

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