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Effective method to disperse and incorporate Carbon nanotubes in electroless Ni-P deposits

机译:将碳纳米管分散并结合到化学镀Ni-P沉积物中的有效方法

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The ever-increasing demand for higher I/O counts on chip requires the finer pitches to improve the performance, cost effectiveness and higher yield. The conventional under bump metallization (UBM) technology may not guarantee the required performance due to higher current density and diffusivity nowadays. In order to overcome these challenges, a UBM with higher strength and resistance to diffusion, better thermal and microstructural properties are required. Recently, nano reinforced Ni-P alloy has been identified as potential approach. Especially, the addition of Carbon nanotube (CNT) was expected to provide strengthening to the resulting UBM layers. CNTs have exceptional and attractive thermal, electrical, and mechanical properties, and are believed to be ideal material for fabricating composites. However, due to the large surface volume ratio, CNTs have strong tendency to agglomerate, which results in clusters. CNT clusters may lead to void formation and further cracking. Therefore, it is of great importance to figure out methods to disperse and incorporate CNTs into Ni-P UBM. In order to disperse carbon nano-tubes in electroless Ni-P coatings, two approaches were employed. Chemical modification, which includes acid oxidation treatment and surfactant treatment were conducted to disperse CNT clusters. Meanwhile, magnetic stirring and ultrasonic agitation were also employed to prepare the CNT/Ni-P composite coatings with CNTs homogeneously embedded. SEM and TEM were used to observe the dispersion after adopting the aforementioned treatment as well as the surface morphology of the deposited layers. It was verified that the dispersion can be significantly improved after proper treatment process, and surface of the CNT/Ni-P was quite smooth; CNTs were equably dispersed throughout the matrix. In addition, the interfacial bonding between CNTs and Ni-P coatings was good and firm. In these cases, an understanding of the effects of the acid oxidation, surfactant dispersant- magnetic stirring and ultrasonic agitation on CNT dispersion in both solution and deposited layer were ascertained.
机译:对更高的片上I / O数量的不断增长的需求要求更细的间距以提高性能,成本效益和更高的良率。由于当今更高的电流密度和扩散率,传统的凸块下金属化(UBM)技术可能无法保证所需的性能。为了克服这些挑战,需要具有更高强度和抗扩散性,更好的热和微结构特性的UBM。最近,纳米增强的Ni-P合金已被确定为潜在的方法。特别地,预期碳纳米管(CNT)的添加将增强所得的UBM层。 CNT具有出色的热,电和机械性能,被认为是制造复合材料的理想材料。然而,由于大的表面体积比,CNT具有强烈的附聚趋势,这导致簇。 CNT簇可能导致空隙形成和进一步开裂。因此,寻找将CNT分散并结合到Ni-P UBM中的方法非常重要。为了将碳纳米管分散在化学镀Ni-P涂层中,采用了两种方法。进行了化学修饰,包括酸氧化处理和表面活性剂处理,以分散CNT簇。同时,还采用磁力搅拌和超声搅拌的方法制备了均匀嵌入CNT的CNT / Ni-P复合涂层。采用SEM和TEM观察经过上述处理后的分散性以及沉积层的表面形态。经验证,经过适当的处理后,分散性可以得到显着改善,并且CNT / Ni-P的表面非常光滑。 CNT均匀地分散在整个基质中。此外,CNT与Ni-P涂层之间的界面结合良好而牢固。在这些情况下,确定了对酸氧化,表面活性剂分散剂-磁力搅拌和超声搅拌对溶液和沉积层中CNT分散的影响的理解。

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