Currently we achived to develop new lower modulus (<1.8GPa) materials with a small film shrinkage (<15%), lower residual stress (<20Mpa), and good chemical resistance at low curing temperature around 200C. These new materials provide good lithography performance at verious film thikness from 5um to 30um without deterioration of physical properties. The whole performance have been designed with new polymer concept which is containing flexible unit and crosslinking unit in polymers, and are also well-balanced to satisfy various reliability performance at thermal cycle test (TCT), PCT and high accelated stress test (HAST) conditions. For this new deisgned polymers, we hamonized our own lithography knowledge for semiconductior and pertochemical technology for polymerization technique.
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