This paper describes a use of TGA kinetics calculations in predicting properties of materials at the end of life of particular hardware. The intended application has a profile of times and temperatures that represent the exposure of this hardware over its life. Using the Flynn-Wall-Ozawa method for determining the decomposition rate law parameters, it is possible to estimate the amount of decomposition that accrues during each exposure condition. The rate law parameters then can be used to select a time and temperature to reach the total projected decomposition. After aging for that time and temperature, physical properties of interest can be measured and compared with performance requirements to determine whether the material is a suitable choice for a given application. The example discussed in this paper is a silver-filled epoxy ink. The physical properties of interest were adhesion, modulus, thermal expansion, and electrical resistivity. While there was some change in these properties, the material was projected to meet the requirements at the end of life.
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