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Point-contacting by Localised Dielectric Breakdown: A robust approach to contacting silicon for solar applications

机译:通过局部介电击穿实现点接触:太阳能应用中一种可靠的硅接触方法

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We report on the development of a previously demonstrated contacting scheme for Al contacts through a-Si to p-type silicon Point-contacting by Localised Dielectric Breakdown (PLDB) in a number of different metal-insulator-semiconductor structures. It is shown that PLDB works for different metals and dielectrics as well as for n-type Si. Investigations into the PLDB technique have revealed that dielectric breakdown initiates the processing leading to Joule heating creating the low resistance contact, rather than a metal induced crystallisation from the gate/dielectric interface.
机译:我们报告了先前证明的通过多种不同的金属-绝缘体-半导体结构中的局部电击穿(PLDB)通过a-Si到p型硅进行Al接触的接触方案的发展情况。结果表明,PLDB适用于不同的金属和电介质以及n型硅。对PLDB技术的研究表明,介电击穿会启动导致焦耳加热的过程,从而产生低电阻接触,而不是金属引起的从栅极/介电界面的结晶。

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