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Mechanisms of MLCCs Insulation Resistance Degradation Under Highly Accelerated Temperature and Humidity Stress

机译:高温,高湿应力下多层陶瓷电容器绝缘电阻降低的机理

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In recent years, failure mechanisms under high temperature / high voltage conditions (HALT: highly accelerated life test) of monolithic ceramic capacitors (MLCCs) with Ni internal electrodes have been investigated. Generally, the insulation resistance degradation in HALT is attributed to electro-migration of oxygen vacancies. Additionally, reliability under high temperature / high humidity and rated-voltage environments is also important for MLCCs. However, only a few works have been conducted on the causes of insulation resistance degradation of MLCCs under these environments. Therefore, in this study, we investigate the failure mechanisms of MLCCs under highly accelerated temperature and humidity stress test (HAST). As a result, the insulation resistance degradation in HAST was considered to be due to the effect of hydrogen ions.
机译:近年来,已经研究了带有镍内部电极的单片陶瓷电容器(MLCC)在高温/高压条件下的失效机理(HALT:高加速寿命测试)。通常,HALT中绝缘电阻的降低归因于氧空位的电迁移。此外,对于MLCC,高温/高湿度和额定电压环境下的可靠性也很重要。但是,在这些环境下,关于MLCC的绝缘电阻降低的原因仅进行了很少的研究。因此,在这项研究中,我们研究了在高度加速的温度和湿度应力测试(HAST)下MLCC的失效机理。结果,认为HAST中的绝缘电阻降低是由于氢离子的作用。

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