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Reliable and high performance STT-MRAM architectures based on controllable-polarity devices

机译:基于可控极性设备的可靠和高性能的STT-MRAM架构

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Source degeneration of access devices in the parallel (P)_ anti-parallel (AP) switching in Spin Transfer Torque Magnetic Random Access Memories (STT-MRAM) has ultimately been a limiting factor in the operational speed of these types of memories. In this work, new architectures for memory single-cells and arrays of cells are presented that utilize Schottky-Barrier Silicon Nanowire Field Effect Transistors with polarity control capabilities (e.g., SiNW-FETs), to substantially increase the performance of STT-MRAM, specifically Multi-Level Cell (MLC) STT-MRAM. The proposed design offers built-in reliability improvement as it omits one of the available four states in the MLC STT-MRAM memory facilitating the resistance level detection for peripheral circuitry. Our simulation results of the developed memory cell show 49.7% reductions in P-AP switching time, as well as 51.3% increases in available drive current under 1.4V supply voltage when compared to FinFET 22imi technology. With respect to memory arrays, the proposed architecture demonstrates an average write latency reduction of 37% in comparison with FinFET 22nm technology node.
机译:在旋转传递扭矩磁随机接入存储器(STT-MRAM)中的并联(P)_反并联(AP)切换的源退化最终是这些存储器的操作速度的限制因素。在这项工作中,提出了用于存储器单电池和单元阵列的新架构,其利用具有极性控制能力(例如,SINW-FET)的肖特基屏障硅纳米线效应晶体管,以显着增加STT-MRAM的性能,具体地提高STT-MRAM的性能多级单元(MLC)STT-MRAM。所提出的设计提供了内置可靠性改进,因为它省略了MLC STT-MRAM内存中的可用四种状态,便于外围电路的电阻电平检测。与FinFET 22IMI技术相比,我们开发的存储器单元的仿真结果显示为P-AP开关时间的49.7%,在1.4V电源电压下,可用的驱动电流增加51.3%。关于内存阵列,所提出的体系结构与FinFET 22nm技术节点相比,展示了37%的平均写入延迟减少。

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