Thermal-aware memory management unit of 3D-stacked DRAM for 3D high definition (HD) video

摘要

With the increasing resolution of 3D high definition (HD) video, high bandwidth, large capability, low power memory becomes essential. In this paper, a thermal-aware hierarchal memory management unit (MMU) in a 3D-Stacked DRAM model is proposed for 3D HD video systems. By constructing the 4Gb, 4-stack 3D DDR3 DRAM model with through-silicon-vias (TSVs), the data bandwidth can be up to 21.3 GB/s @ 333MHz. Additionally, an efficient address translator, a global rank controller and local slice controllers are proposed in the hierarchal MMU for 3D Full HD video disparity calculation. The hierarchal MMU can improve bandwidth by 54.3% through command reordering and bank/rank interleaving. Moreover, power reduction of up to 43.46% can be realized in low power mode by the dynamic thermal-aware refresh timing control and deep power down detection.