electric resistance measurement; electromigration; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; solders; three-dimensional integrated circuits; 2.5D integrated circuit chips; 3D integrated circuit chips; IC interconnection lines; TSV-solder resistance measurement; electromigration reliability; electromigration test; microsolder bump; revisit resistance monitoring techniques; test structure; Abstracts; Bridges; Electrical resistance measurement; Monitoring; Reliability; Temperature measurement; Through-silicon vias;
机译:一种测试焊料电迁移电阻的简单方法
机译:一种测试焊料电迁移电阻的简单方法
机译:应对电迁移测试中阻焊剂测量中的挑战
机译:重新抵抗电阻监测技术在电迁移试验期间测量TSV /焊接电阻
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机译:1999年至2002年通过国家抗菌素耐药性监测系统对美国志贺氏菌分离株中的抗菌素耐药性高发进行了测试
机译:测量690合金及其焊缝金属pWsCC电阻的先进测试技术
机译:测量690合金及其焊缝金属pWsCC电阻的先进测试技术