Orthogonal wideband (DC-10 GHz) microstrip-to-microstrip transition using flexible LCP interconnects

摘要

This paper presents an orthogonal, broadband microstrip-to-microstrip RF transition at the board level. The transition was achieved by bonding a single metal trace fabricated on Rogers Ultralam 3850 Liquid Crystal Polymer (LCP) substrate to microstrip lines made on RO3003 substrates. 3D FEM simulations in Ansoft HFSS and measured data show that S for this transition is less than 1 dB over a wide range of frequencies from DC-9.5 GHz. The insertion loss per unit length remains below 0.5 dB/cm below approximately 10 GHz.