Automated Physical Verification of I/O Pads in Full-Custom Environment

摘要

In the final phase of Input/Output (I/O) pad library development, new methods for physical verification of I/O pads are proposed to verify the integrated circuit design for manufacturability and electrical connectivity rules. While I/O pad ring is constructed to verify Design Rule Check (DRC) and Antenna DRC checks, an I/O pad pattern is developed to check Electrical Rule Check (ERC) which brings a new paradigm to the sign off verification methods. The automated verification process is tested over different bond package I/O libraries spanning across different technologies in Cadence Design Framework (DFII) full custom platform to demonstrate significant reduction in manual effort and increase efficiency in verification methods.