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A Novel GNR Interconnect Model to Reduce Crosstalk Delay

机译:减少串扰延迟的新型GNR互连模型

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In this research article, we have proposed a reduced thickness graphene nanoribbon (GNR) interconnect model to reduce crosstalk effects. The 10× higher current capability of GNR than copper (Cu) makes it an attractive choice to alleviate electro migration problem. The lower resistance of GNR is also an important factor to reduce interconnect delay. We have shown that the thickness of GNR interconnect can be reduced to reduce the crosstalk effects significantly without compromising the other benefits. Our analysis shows that the reduced thickness GNR interconnect can achieve ~2-3× reduction in crosstalk induced delay compared with Cu interconnects.
机译:在这篇研究文章中,我们提出了一种厚度减小的石墨烯纳米带(GNR)互连模型,以减少串扰效应。 GNR的电流容量比铜(Cu)高10倍,是缓解电迁移问题的诱人选择。 GNR的较低电阻也是减少互连延迟的重要因素。我们已经表明,可以减小GNR互连的厚度以显着降低串扰效应,而不会损害其他好处。我们的分析表明,与铜互连相比,厚度减小的GNR互连可以减少2-3倍的串扰引起的延迟。

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