Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal

摘要

Among the technological developments pushed by the emergence of 3D-ICs, wafer thinning has become a key element in device processing over the past years. As technology matures, more emphasis is now being put on the overall cost of ownership, which is still regarded as a refraining element for technology adoption. Therefore novel temporary bond concepts and materials are being explored to further bring down the process complexity and cost.