The use of vias as interconnection structure in high-density System on Package (SoP) substrates and Printed Circuit Boards (PCBs) is the most common solution to route signals in multilayer structures. However this configuration poses a problem in term of Simultaneous Swithching Noise (SSN) producing false switching in digital circuits and malfunctioning in analog circuits. The purpose of this work is to present a novel planar Electromagnetic Bandgap (EBG) structure which is able to overcome this drawback within a large bandwidth (1.0 GHz -6.6 GHz) with a good suppression level (less than -30 dB) and also along a wide range of directions.
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