Next-Generation Lead-Free Solder Plating Products for High Speed Bumping, Capping and Micro-Capping Applications

摘要

Flip-chip interconnect and 3-D packaging applications must utilize reliable lead-free solder joints in orderto produce highly efficient, advanced microelectronic devices. The solder alloy most commonly utilized forthese applications is SnAg, which is typically deposited by electroplating due to lower cost and greaterreliability as compared to other methods. The electroplating performance and robustness of SnAg productsfor bumping and capping applications is highly dependent on the organic additives used in the process.Here, next-generation SnAg products that improve the rate of solder electrodeposition withoutcompromising key requirements such as tight Ag% control, uniform height distribution and smooth surfacemorphology will be discussed. These plated solders were then evaluated for compatibility with bumping,capping and micro-capping applications.