Study of temperature profile influence on intermetallic growth

摘要

This article deals with the study of influence of temperature profile on the intermetallic layer growth and its thickness. There are many studies that observed the IMC growth, but only few evaluate the IMC growth in dependence on the heating factor. The heating factor is defined as an amount of heat added after the moment when the solder alloy is already in the liquid state. Two solder pastes, SnBi and Sn96.5/Ag3.0/Cu0.5 were used for experiments. Copper with OSP surface finish was chosen as a soldering material for the pads. The results confirm that it is the heating factor that has a decisive influence on the thickness of intermetallic layer.