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A bi-criteria mixed integer linear programming model for load balancing and chemical saving in wafer cleaning processes: IE: Industrial engineering

机译:晶圆清洁工艺负载平衡和化学节能的双标准混合整数线性规划模型:IE:工业工程

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Semiconductor manufacturing or wafer fabrication process involves multiple processing steps and is highly re-entrant, where a job may visit an equipment group more than once, at various stages of the product flow. Wafer cleaning process in semiconductor fabrication comprises multiple steps at various stages of the product flow to remove particles and oxidize organic contaminants, using different chemicals. This paper focusses on front-end of the line wafer cleaning steps. We consider J equipment groups which run I clean process steps and uses M different chemicals. Each step is qualified to run on a set of equipment groups and when recipes using different chemical run back to back on a tool-there is a chemical pre-dispense to clean and condition the nozzle. Given today's increasingly cost-conscious and competitive market, this study focuses on balancing loads on the equipment groups and minimize operating cost by reducing chemical pre-dispenses. We propose a bi-criteria mixed integer linear programming model to allocate daily demands to the equipment groups with the objectives of minimizing the maximum utilization and reducing chemical pre-dispenses. We also propose a priority based dispatching algorithm to translate the model output and implement in a dispatching system. Results show that the model reduces chemical pre-dispense resulting in significant cost saving, improved throughput due to cascading, and balanced utilization across the equipment groups.
机译:半导体制造或晶片制造工艺涉及多个处理步骤并且是高度再参赛者,其中作业可以在产品流程的各个阶段中多次访问设备组。半导体制造中的晶片清洁过程包括在产物流动的各个阶段的多个步骤,以使用不同的化学物质去除颗粒并氧化有机污染物。本文侧重于线晶圆清洁步骤的前端。我们考虑运行我清洁流程步骤的J设备组,并使用不同的化学品。每个步骤都有资格在一组设备组上运行,当使用不同化学物质返回到工具上的食谱时 - 有一种化学预分配,可以清洁和调节喷嘴。鉴于当今日益增强和竞争激烈的市场,本研究专注于平衡设备组上的负载,并通过减少化学预售来最大限度地减少运营成本。我们提出了一项双标准混合整数线性规划模型,以利用最大限度地利用和减少化学预处理的目标来分配日常需求。我们还提出了一种基于优先的调度算法,可在调度系统中转换模型输出和实现。结果表明,该型号可降低化学预分配,从而降低了显着的节省成本,提高了由于级联而导致的渗透率,以及设备组的平衡利用率。

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