Electrostamping through sam layer for 1:1 transfer of 40-NM-wide patterns over MM2 area

摘要

The paper reports a novel approach to improve transfer resolution and transfer uniformity of electrostamping, based on thin-film edge electrode lithography (TEEL). TEEL transfers nanopatterns collectively corresponding to thin-film edge electrodes on a mold according to an electrochemical reaction in the water meniscus formed between the mold and the substrate. High relative humidity can ensure the meniscus forms stably for uniform transfer, while resolution can be degraded due to meniscus extension. A hydrophobic SAM layer is used for the first time on the contact surfaces of the electrostamping mold to control meniscus size and thereby to achieve high-resolution; 1:1 transfer of 40-nm-wide patterns over several mm2 area was achieved.