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Improved Carrier Mobility of Thin Ge Films on Insulator by Solid-Phase Crystallization Combined with Interface-Modulation

机译:通过固相结晶与界面调制结合改善薄GE膜对绝缘体的载体迁移率

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High-carrier-mobility thin (≤ ~50 nm) films on insulator are needed to realize high-performance fully-depleted transistors. To achieve this, an advanced solid-phase crystallization technique of Sn-doped Ge (GeSn) on insulator has been developed. By introduction of a-Si under-layers between GeSn/substrate interfaces, energy barrier for carriers at grain-boundaries in grown films is significantly decreased. As a result, thin (~50 nm) poly-GeSn films with high carrier mobility of ~300 cm2/Vs are obtained by using a-Si under-layers. This mobility is the highest among ever reported data for Ge and GeSn thin-films (≤50 nm) on insulator grown at low-temperatures (≤500°C).
机译:需要在绝缘体上薄(≤〜50nm)薄膜来实现高性能完全耗尽的晶体管。为此,已经开发了绝缘体上的SN掺杂GE(GESN)的先进固相结晶技术。通过在GESN /衬底接口之间引入A-Si下层,生长薄膜中晶界处的载体的能量屏障显着降低。结果,具有〜300厘米的高载流子迁移率的薄(〜50nm)的多gesn薄膜 2 / vs是通过使用A-Si下层获得的。这种流动性是GE和GESN薄膜(≤50nm)在低温(≤500°C)的绝缘体上的GE和GESN薄膜(≤50nm)中最高。

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