Numerical Models of the Electrochemical Migration: a short review

摘要

Electrochemical migration has attracted more attention from researchers due to its high risk of electronics reliability. It is a multistage process that may result in catastrophic failure of electronics. The growing interest of this phenomenon requires precise modeling to predict the time-to-failure, which consists of two main stages, incubation and growth of dendrites. This paper presents a short overview regarding the ECM process, main factors affecting the process., the main historical numerical models for electrochemical deposition in electrochemistry., electrochemical migration on electronics., and the importance of machine learning in building up more precise lifetime models compared to physics of failure models.