首页> 外文会议>International Conference on Simulation of Semiconductor Processes and Devices >CMOS Scaling Analysis based on ITRS Roadmap by Three-dimensional Mixed-mode Device Simulation
【24h】

CMOS Scaling Analysis based on ITRS Roadmap by Three-dimensional Mixed-mode Device Simulation

机译:三维混合模式设备仿真基于ITRS路线图的CMOS缩放分析

获取原文

摘要

In this paper, the circuit performances such as circuit delay, RF characteristics and SRAM static noise margin are presented. These analyses are performed by three-dimensional device simulation using Mixed-mode option. The benefit of circuit delay in scaling will be maintained by introducing new structure (SOI, multi-gate), material (silicide, metal gate) and strain effect. However, concerning with SRAM SNM, it becomes already difficult to operate even in 65nm node.
机译:本文介绍了电路延迟,RF特性和SRAM静态噪声裕度的电路性能。 这些分析由使用混合模式选项进行三维设备仿真执行。 通过引入新的结构(SOI,多栅极),材料(硅化物,金属栅极)和应变效应,将维持缩放电路延迟的好处。 然而,关于SRAM SNM,即使在65nm节点中也变得难以操作。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号