HIGH-RESOLUTION STRAIN SENSING ON STEEL BY SILICON-ON-INSULATOR FLEXURAL RESONATORS FABRICATED WITH CHIP-LEVEL VACUUM PACKAGING

摘要

This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/με), very high resolution (4 nε), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes.