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O2-Enhanced surface treatment of Ge epitaxially grown on Si for heterogeneous Ge technology

机译:O 2 -NIAPING表面处理GE在SI外延生长的外均匀GE技术

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In this work, in order to investigate the effects of annealing gases on the quality of Ge epitaxially grown on Si substrate, ex-situ rapid thermal annealing (RTA) processes with different gases have been performed. The Ge-on-Si samples were prepared by different growth techniques using reduced-pressure chemical vapor deposition (RPCVD), and then, samples annealed in the N2, forming gas (FG), and O2 were compared with an unannealed one to confirm the improvements in Ge quality. To evaluate the material quality, photoluminescence (PL) measurements have been carried out for the samples at room temperature. Among the prepared samples, the O2-annealed sample showed the highest PL signals regardless of growth techniques, which supports that an ex-situ RTA in the O2 ambient would be an effective technique for surface treatment of Ge in the fabrication processes of Ge-based electronic and photonic devices.
机译:在这项工作中,为了研究退火气体对Si衬底上外延生长的GE的质量的影响,已经进行了具有不同气体的ex-situ的快速热退火(RTA)方法。通过使用减压化学气相沉积(RPCVD),通过不同的生长技术制备Ge-on-Si样品,然后,将在N 2中退火,形成气体(FG)和O2的样品与未经发蜡的物体进行比较以确认GE质量的改进。为了评估材料质量,已经在室温下对样品进行了光致发光(PL)测量。在制备的样品中,O2退火样品显示出最高的PL信号,无论生长技术如何,它支持O2环境中的前原位RTA是GE在基于GE的制造过程中GE的有效技术电子和光子器件。

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