Nanofabrication Techniques for Wireless, Real-Time Fully Integrated Sensing Platforms

摘要

Designing small scale integrated systems for sensing and actuation has gained lots of interest in recent years. Currently, subsystems are fabricated separately and then bonded together to form an integrated platform. This poses a fundamental limit on the size and design of such systems and also on their longevity and performance. Here, we present methods of designing and fabricating such systems using standard fabrication techniques on standard electronic substrates to result in very small, fully integrated systems. These techniques provide a set of tool to convert such electronic systems into complete sensing/actuation platforms which can then be used for many different applications. Furthermore, the CMOS-compatibility of these techniques makes it possible to integrate these processes in commercial CMOS foundries to reduce the complexity and hence cost of fabricating such systems. Finally, we will show results of sensing using the devices fabricated with these techniques.