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Preparation and properties of silicone -cycloaliphatic epoxy resins for LED packaging

机译:LED包装硅氧烷 - 环脂族环氧树脂的制备及性能

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Silicone-cycloaliphatic epoxy resins were successfully synthesized by a two-step reaction route: (i) hydrosilylation of 1,3,5,7-tetramethylcyclotetrasiloxane (TMCTS) and 2-epoxy-4-vinyl-cyclohexane,and then blocking of unreacted Si-H with n-butanol, (ii) In order to reduce the viscosity, different amounts of active diluent(Allyl Glycidyl Ether) was added into (i). The molecular structures of the hydrosilylation of 1,3,5,7-tetramethylcyclotetrasiloxane (TMCTS) were characterized by Fourier transform infrared (FT-IR) and nuclear magnetic resonance (1H NMR). The results show that active diluent plays an important role in the silicone -cycloaliphatic epoxy resins for LED packaging. Compared with the pure silicone-cycloaliphatic epoxy resins, the silicone-cycloaliphatic epoxy resins with 5 phr of active diluent had higher initial decomposition temperaturwere. Mechanical property tests show that the tensile strength of the silicone -cycloaliphatic epoxy resins with 5 phr of active diluent are 10.1MPa which increases by 114.38% compared with that of the neat silicone -cycloaliphatic epoxy resins, and the elastic modulus of increases by 119.54%. Moreover, the characteristics of transmittance of the silicone -cycloaliphatic epoxy resins with 5 phr active diluent(>95%, 400-800 nm) was better than that of the neat silicone -cycloaliphatic epoxy resins. The shore hardness and impact toughness of the silicone-cycloaliphatic epoxy resins provide good performance. The pendulum impact test shows that the silicone -cycloaliphatic epoxy resins with 10 phr of active diluent reaches 2.3KJ/m2. The shore hardness of the silicone - cycloaliphatic epoxy resins with 20 phrof active diluent reaches 80D.
机译:硅氧烷 - 脂环族环氧树脂成功地被一个两步反应路线合成:(ⅰ)1,3,5,7-四甲基环四硅氧烷(TMCTS)和1,2-环氧-4-乙烯基环己烷,氢化硅烷化,然后阻断未反应的Si的-H用正丁醇,(ⅱ)为了降低粘度,溶液中加入不同量的活性稀释剂(烯丙基缩水甘油醚)的成(i)中。通过傅立叶变换红外(FT-IR)和核磁共振(1 H NMR)1,3,5,7-四甲基环四氢化硅烷化(TMCTS)的分子结构进行了表征。结果表明,活性稀释剂起着在硅氧烷 - 环状环氧树脂为LED封装具有重要作用。与纯有机硅类的脂环族环氧树脂相比,具有5份活性稀释剂的硅氧烷 - 脂环族环氧树脂具有较高的初始分解temperaturwere。力学性能测试表明,与5份活性稀释剂的硅氧烷 - 环状环氧树脂的拉伸强度是10.1MPa,其通过114.38%增加与纯硅 - 环状环氧树脂,以及由119.54%的增加的弹性模量的比较。此外,与5份活性稀释剂(> 95%,400-800纳米)的有机硅 - 环状环氧树脂的透射率的特性较纯的硅 - 环状环氧树脂更好。有机硅 - 脂环族环氧树脂的肖氏硬度和冲击韧性提供良好的性能。摆锤冲击试验表明,与10份活性稀释剂的硅氧烷 - 环状环氧树脂达到2.3KJ /平方米。硅树脂的肖氏硬度 - 脂环族环氧树脂与20 phrof活性稀释剂达到80D。

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