Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board

摘要

The manufacturing process of Printed Circuit Boards (PCB) with embedded active components requires several modifications on the build-up layer configuration, including the use of thinner layers and heterogeneous composite materials. From the point of view of second level interconnects the increase in density and complexity of the build-up of electronic board leads to an increase of the total resin-content. As demonstrated in a previous work, this increase of the ratio between resin and glass has a major consequence on the mechanical behavior of the assemblies, particularly on the fatigue resistance of component solder joints. This paper describes the research studies using experimental tests and finite element analysis techniques led within an European project on passive and active components embedded in PCB. A comprehensive test methodology was developped in order to evaluate the thermo-mechanical behavior of PCB with embedded active components and its impact on reliability of electronic assemblies. This methodology includes base material characterization, thermo-mechanical analysis and finite element simulations.