Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM

摘要

3D microelectronic components are exposed to electrical, thermal, mechanical and chemical stresses generated by storage, transport, manipulation, functioning and environment. The reliability of the components depends partially on the reliability of interconnections which insures the mechanical and the electrical junctions between components and printed circuits. Reliability has to be evaluated on mechanical demonstrators before the production stage. It is currently studied by employing standardized tests.