Invited Talk: Simulation-Based Design and Optimization for Future Mobility Electronics Systems

摘要

Multiphysics simulation and optimization has emerged as a powerful approach in the design of high power density electronics systems. Such systems involve a broad range of physics including thermal, fluidic, electrical, electromagnetic, and mechanical phenomena at multiple physical length scales. In this article, a brief review is provided on the use of gradient-based topology optimization for simulation-based design of electronics components. As shown herein, heat transfer is of primary interest for modern high-density electronics, and specific examples are provided in different thermal, thermal-mechanical, and thermal-fluid multiphysics contexts. Performance benefits are quantified both numerically and, in select cases, experimentally. Additional research directions are further proposed.