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Study of Circuit Evolution to Repair Design Flaws in FPGA Edge Computing Chips

机译:在FPGA边缘计算芯片修复设计缺陷的电路演化研究

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Field Programmable Logic Gate Array (FPGA) seems to be a semicustom circuit in the field of special application integrated circuits and use in edge computing. In this study, the chip-level reliability design of the system is carried out from the perspective of fault tolerance and fault self-repair. A real-time fault-tolerant self-repair system structure based on SRAM FPGA is proposed, and the design structure is verified on Xilinx Virtex-6 FPGA. It was found that the energy consumption of different modules in this study increased under the fault-tolerant self-repair design, and when the number of carry chains increased, the detection delay and reconstruction time also increased, which is in line with physical phenomena. However, it has been verified by the designer, it is found that the design time of the designer can be greatly reduced by about 50%, which is an important contribution.
机译:字段可编程逻辑门阵列(FPGA)似乎是特殊应用集成电路领域的半导体电路,并在边沿计算。在这项研究中,系统的芯片级可靠性设计是从容错和故障自修复的角度进行的。提出了一种基于SRAM FPGA的实时容错自修复系统结构,在Xilinx Virtex-6 FPGA上验证了设计结构。结果发现,本研究中不同模块的能量消耗在容错自修复设计下增加,当携带链的数量增加时,检测延迟和重建时间也增加,这与物理现象符合。然而,它已经由设计师验证,发现设计师的设计时间可以大大降低约50%,这是一个重要的贡献。

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