Integrated Electrical Test Vehicle Co-designed with Microfluidics for Evaluating the Performance of Embedded Cooling

摘要

From the dawn of the Information Age thermal management technology has played a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. The key advantage of embedded, versus conventional cooling is a reduction in the number of thermal interfaces between the heat source and the heat sink. Considerable research efforts have been devoted to improving the heat transfer efficiency through embedded cooling. However, there is a lack of a universal test platform to characterize the thermal performance of the embedded structure. In this work, an integrated electrical test vehicle co-designed with embedded cooling is proposed for evaluating the cooling performance of the embedded microfluidic structure and the overall dimension of the vehicle is under $30 imes 15imes 2 ext{mm}^{3}$. It provides a tool for analyzing the performance of embedded cooling and proposes a method for further study of embedded cooling mechanism.