首页> 外文会议>International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors >Trap Densities in ZnO TFTs with SiN_x/SiO_x Stacked Gate Insulators Fabricated using Several N_2O Flow Rate during SiO_x Deposition
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Trap Densities in ZnO TFTs with SiN_x/SiO_x Stacked Gate Insulators Fabricated using Several N_2O Flow Rate during SiO_x Deposition

机译:ZnO TFT中的陷阱密度使用SIN_X / SIO_X堆叠栅极绝缘体使用MIO_X沉积期间使用几个N_2O流量制造

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The trap densities (D_t) in ZnO thin-film transistors (TFTs) with SiN_x/SiO_x stacked gate insulators fabricated using several N_2O flow rate during SiO_x deposition (R_(N_2O)) are extracted. It is found that the trap states consist of deep flat states and shallow tail states. The deep states are similar, whereas the tail states vary as R_(N_2O) varies. It is also found that the degree of the characteristic stability corresponds to D_t of the tail states.
机译:提取使用MIC_X / SIO_X堆叠栅极绝缘体的ZnO薄膜晶体管(TFT)中的陷阱密度(D_T),使用了在SIO_X沉积期间(R_(N_2O))制造的SIN_X / SIO_X堆叠栅极绝缘体。发现陷阱状态包括深态和浅尾态。深度状态相似,而尾部状态因R_(N_2O)而变化而变化。还发现特征稳定性的程度对应于尾态的D_T。

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