首页> 外文会议>International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors >Novel Integration Process for IGZO MO-TFT Fabrication on Gen 8.5 PECVD and PVD Systems A Quest to Improve TFT Stability and Mobility
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Novel Integration Process for IGZO MO-TFT Fabrication on Gen 8.5 PECVD and PVD Systems A Quest to Improve TFT Stability and Mobility

机译:在8.5代PECVD和PVD系统上制造IGZO MO-TFT的新型集成工艺,旨在提高TFT的稳定性和移动性

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IGZO is one of the promising materials being used to make high-mobility TFTs for high-quality displays. However, a-IGZO TFTs have stability issues in addition to limited mobility (<10 cm~2/Vs). AKT has made a stable a-IGZO TFT through ESL optimization and plasma treatment of the IGZO interface. AKT a-IGZO ES-TFT shows SS 0.4 ±0.1 V/dec, mobility 10 ±1.0 cm~2/Vs, Von 0.25 ± 1.5V over 2200 x 2500 mm~2 substrate. BTS stability range under 80°C, ±50V conditions is ~1.5V. Furthermore, another AKT MO ES-TFT shows >30 cm~2/V·s mobility using multi-layer structure.
机译:IGZO是用于制造用于高质量显示器的高迁移率TFT的有前途的材料之一。但是,a-IGZO TFT除迁移率有限(<10 cm〜2 / Vs)外,还存在稳定性问题。 AKT通过ESL优化和IGZO接口的等离子处理,制成了稳定的a-IGZO TFT。 AKT a-IGZO ES-TFT在2200 x 2500 mm〜2的基板上显示SS 0.4±0.1 V / dec,迁移率10±1.0 cm〜2 / Vs,Von 0.25±1.5V。 BTS在80°C,±50V条件下的稳定范围为〜1.5V。此外,另一种AKT MO ES-TFT使用多层结构显示出> 30 cm〜2 / V·s的迁移率。

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