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Totally self-checking (TSC) VLSI circuits using Scalable Error Detection Coding (SEDC) technique

机译:使用可扩展错误检测编码(SEDC)技术的完全自检(TSC)VLSI电路

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Integrated circuits fabricated in deep sub-micron technology are vulnerable to intermittent or transient faults which are the predominant cause of system failures. With continued scaling, operating voltage levels have reduced and resultant decrease in noise margins, the possibility of transient faults is likely to increase. Also, during operation in adverse environments, transient faults occur upon exposure to ionizing radiations and neutron effects. These faults manifest themselves as unidirectional errors. The ability to operate in the intended manner even in the presence of faults is an important objective of all electronic systems. Totally Self-checking (TSC) circuits permit online detection of hardware faults. The Scalable Error Detection Coding (SEDC) technique used to design self-checking circuits with faster execution and lesser latency overhead for use in fault-tolerant VLSI circuits is presented. SEDC technique is formulated and architecture is designed in such a way that for any input binary data length, only area is scaled, with a constant latency of two logic gates and requires only a single clock cycle for generating SEDC code. It is shown that the proposed SEDC technique is found to be significantly efficient than the existing unidirectional error detection techniques in terms of speed, latency, area and achieving 100% error detection.
机译:用深亚微米技术制造的集成电路易受间歇性或瞬态故障的影响,这是系统故障的主要原因。随着规模的不断扩大,工作电压水平降低,噪声容限随之降低,瞬态故障的可能性可能会增加。同样,在不利环境下运行期间,由于暴露于电离辐射和中子效应,会发生瞬态故障。这些故障表现为单向错误。即使在出现故障的情况下,以预期方式工作的能力也是所有电子系统的重要目标。完全自检(TSC)电路允许在线检测硬件故障。提出了用于设计自检电路的可伸缩错误检测编码(SEDC)技术,该电路具有更快的执行速度和更小的延迟开销,供容错VLSI电路使用。制定了SEDC技术并设计了架构,以使得对于任何输入二进制数据长度,仅按比例缩放区域,并具有两个逻辑门的恒定等待时间,并且仅需一个时钟周期即可生成SEDC代码。结果表明,在速度,等待时间,面积和实现100%错误检测方面,所提出的SEDC技术比现有的单向错误检测技术具有显着的效率。

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