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A Resistance-Drift Compensation Scheme to Reduce MLC PCM Raw BER by Over 100× for Storage-Class Memory Applications

机译:电阻漂移补偿方案,以减少100×存储级存储器应用程序的MLC PCM原始BER

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The large performance gap between traditional storage and the rest of the memory hierarchy calls for a storage class memory (SCM) to fill the need. Phase change memory (PCM) is an emerging memory candidate for SCM with the advantages of scalability, bit-alterability, non-volatility, and high program speed. Previous publications demonstrated high-density single-level-cell (SLC) PCMs using circuits and architectural techniques for expanding memory capacity, increasing bandwidth, and enabling embedded applications [1-4]. For PCM to be a true contender, a multi-level-cell (MLC) topology with at least a moderate data retention time is required. However, the resistance-drift (R-drift) effect causes cell resistance (R_(CELL)) to increase with time, exceeding the ECC correction ability within hours of being programmed. Conventional R-drift mitigation approaches using reference-cell-based resistance tracking (RCRT) [5] and DRAM-like refresh (DR) [6] are feasible, but at the cost of compromising distinguished PCM traits: random write, low latency, and low power. This paper proposes a resistance drift compensation (RDC) scheme to mitigate against R-drift without such compromises, while minimizing the speed and power consumption penalties. The MLC-PCM fixed-threshold retention (FTR) raw-bit-error-rate (RBER) has been suppressed by over two orders of magnitude, reducing it below practical ECC capability limits.
机译:传统存储与其余内存层次结构之间的巨大性能差距来调用存储类存储器(SCM)以填补需求。相变存储器(PCM)是SCM的新兴内存候选者,其具有可伸缩性,比特变阻性,非波动性和高程序速度的优点。以前的出版物展示了使用电路和架构技术的高密度单级单元(SLC)PCM,用于扩展内存容量,增加带宽,并启用嵌入式应用[1-4]。对于PCM,成为真正的竞争者,需要至少需要中等数据保留时间的多级单元(MLC)拓扑。然而,电阻漂移(R-漂移)效应导致电池电阻(R_(CELL))随着时间的推移而增加,超过ECC校正能力在被编程的时间内。使用基于参考单元的电阻跟踪(RCRT)[5]和DRAM样刷新(DR)[6]的常规R漂移缓解方法是可行的,但是以折衷的PCM特征的成本:随机写入,低延迟,和低功率。本文提出了阻力漂移补偿(RDC)方案,以减轻r漂移而没有这种折衷,同时最大限度地减少速度和功耗的惩罚。 MLC-PCM固定阈值保留(FTR)原始误码率(rber)已经抑制了两个数量级,将其降低到实际的ECC能力范围内。

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