Polishing is a simple and direct method to prepare samples for failure analysis and characterization. However, polishing commonly gives rise to the issue of rounding at the sample's corners and edges. This is believed to have arisen from the uneven distribution of polishing slurry between the edges and sample surface during polishing. Thus, we propose a new lapping method to reduce the rounding effect. From our experiments, negligible rounding effect was observed on a 9 mm by 7 mm die after a depth of ～ 2 μm of material was removed using our proposed alternative lapping method.
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