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Laser Voltage Imaging: New perspective using second harmonic detection on submicron technology

机译:激光电压成像:在亚微米技术上使用二次谐波检测的新视角

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The Laser Voltage Imaging (LVI) technique [1], introduced in 2009, appears as a very promising approach for Failure Analysis application which allows mapping frequencies through the backside of integrated circuits. In this paper, we propose a new range of application based on the study of the LVI second harmonic for signal degradation analysis. After a theoretical study of the impact of signal degradation on the second harmonic, we will demonstrate the interest of this new approach on two case studies on ultimate technology (28nm). This technique is a new approach of failure analysis that maps timing degradation and duty cycle degradation. In order to confirm the degradations we will use the LVP Technique. The last part is two real case studies on which this LVI second harmonic technique was used to find the root cause of a 28nm process issue.
机译:于2009年推出的激光电压成像(LVI)技术[1]似乎是故障分析应用程序中非常有前途的方法,该方法允许通过集成电路的背面映射频率。在本文中,我们基于对LVI二次谐波的研究,提出了一种新的应用范围,用于信号衰减分析。在对信号衰减对二次谐波的影响进行理论研究之后,我们将在最终技术(28nm)的两个案例研究中展示这种新方法的兴趣。此技术是一种故障分析的新方法,可绘制时序降级和占空比降级。为了确认降级,我们将使用LVP技术。最后一部分是两个实际案例研究,在该案例研究中,使用了LVI二次谐波技术来查找28nm工艺问题的根本原因。

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