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An assessment method of electronic packaging reliability based on rough set theory

机译:一种基于粗糙集理论的电子包装可靠性评估方法

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摘要

With the continuous improvements of IC integration,the electronic packaging reliability became more and more important. As a result, how to evaluate the reliability of the electronic packaging precisely has become a problem to be solved. In this paper, an index system from the packaging material, packaging process and packaging test is put forward. Then, considering many uncertainties induced by the absence and decentralization of electronic packaging information, a rough set theory based model is established to assess the electronic packaging reliability. It is shown from the case study that the model can make the assessment more objective and feasible because it can take more accounts of the uncertainties in the electronic packaging reliability analysis.
机译:随着IC集成的不断改进,电子包装可靠性变得越来越重要。 结果,如何评估电子包装的可靠性正好成为要解决的问题。 本文提出了一种来自包装材料,包装工艺和包装测试的指标系统。 然后,考虑到通过电子包装信息的缺失和分散化引起的许多不确定性,建立了一种粗糙集理论的模型来评估电子封装可靠性。 从案例研究中显示,该模型可以使评估更具目的和可行性,因为它可以更多地考虑电子包装可靠性分析中的不确定性。

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