A Mechanism of Nickel Deposition on Titanium Substrate by High Speed Electro-plating

摘要

Titanium was a notoriously difficult material to electroplate. This problem was associated with the present of a very thin oxide layer which forms immediately after the Ti is exposed to atmosphere; this oxide layer plays the role as a barrier layer to achieve a good level of adhesion between deposited metal and titanium substrate. In this research direct Ni plating on Ti surface using high speed movement of the electrolyte was investigated. It has been proposed that existence of porous on titanium oxide layer have a significant role in order to make it possible to achieve direct Ni electroplating on titanium substrates. When Ni solution passes over the titanium oxide with a rate of about 2. 7 m/s, cations (Ni+2) have a good opportunity to penetrate through the pores and make bondage between deposited Ni and titanium oxide layer. As a result, formation of these bonds improved the level of adhesion between deposited Ni and titanium substrate