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Nanoimprint Lithography technology for high volume manufacturing

机译:用于批量生产的纳米压印光刻技术

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Nanoimprint lithography (NIL) has developed from an emerging nano replication technology into a matured and industrially viable manufacturing technology. Since its invention in the mid 90s, it is now by far the fastest and most cost-efficient nano-replication method available on the market. One of the first industrial adaptations of nanoimprint lithography in manufacturing is to enhance light output of LED's [1,2] and it has been shown that the technology can be used for manufacturing with a high throughput and yield [3] but there are also many other applications with promise such as organic electronics [4] and magnetic media [5]. Obducat uses a IPS®/STU® manufacturing process where no hard materials touch each other during process sequence, see figure 1 (left). The IPS® material is flexible which allows the stamp to adjust to the curvature and roughness of the substrate, thereby giving a uniform residual layer on full wafer scale. This enables imprinting of several different types of wafers such as Ⅲ/V based wafers, flexible substrates, silicon substrates as well as lenses with a curved surface. Focusing on LED production, the wafers used are typically III/V semiconductor materials grown with epitaxial processes. These types of substrates suffer from growth defects like hexagonal spikes, v-pits, waferbowing, atomic steps and surface corrugations on a scale of few 10μm or even large islands of irregularities. The mentioned irregularities are particularly disturbing when NIL based processes are utilized to create patterns onto the wafer surface. The defects can have a height of several μm, which can cause large areas without nano-patterns, substrate breakage or as in the case where the stamp is applied directly onto the substrate, breakage of the stamp itself. Using the IPS®/STU® manufacturing process easily copes with this since no hard materials touch each other during the entire process sequence. Indeed, this is essential for high volume manufacturing where the imprinted nanostructures must have a consistent quality. This paper will show that NIL is the preferred technology to produce nanopatterns on GaN substrates used for producing LEDs. In addition, examples of other application areas such as organic electronics will also be shown.
机译:纳米压印光刻(NIL)已从新兴的纳米复制技术发展成为成熟且在工业上可行的制造技术。自从90年代中期发明以来,它是迄今为止市场上最快,最具成本效益的纳米复制方法。纳米压印光刻技术在制造业中的第一个工业改编之一就是提高LED的光输出[1,2],并且已经表明该技术可以用于高产量和高产量的制造[3],但是还有很多其他有希望的应用,例如有机电子学[4]和磁性介质[5]。 Obducat使用IPS®/STU®制造工艺,该工艺过程中没有硬质材料相互接触,请参见图1(左)。 IPS®材料具有柔韧性,可以使压模适应基材的曲率和粗糙度,从而在整个晶圆尺寸上提供均匀的残留层。这样可以压印几种不同类型的晶圆,例如基于Ⅲ/ V的晶圆,柔性基板,硅基板以及具有曲面的透镜。专注于LED生产,所使用的晶圆通常是通过外延工艺生长的III / V半导体材料。这些类型的基板会遇到生长缺陷,例如六角形尖峰,V形凹坑,晶圆弯曲,原子台阶和表面波纹,其尺寸仅为10μm甚至是大的不规则岛。当利用基于NIL的工艺在晶片表面上创建图案时,上述不规则性尤其令人不安。缺陷的高度可能为几微米,这可能会导致较大的区域而没有纳米图案,基材破损,或者在将压模直接施加到基材上的情况下,压模本身也会破损。使用IPS®/STU®制造工艺很容易解决这一问题,因为在整个工艺过程中,没有硬质材料相互接触。实际上,这对于其中压印纳米结构必须具有一致质量的大批量生产至关重要。本文将显示NIL是在用于生产LED的GaN衬底上生产纳米图案的首选技术。此外,还将显示其他应用领域的示例,例如有机电子产品。

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