Development of Composite Abrasives and Epoxy resin Polishing Pads to Reduce the use of CeO_2 Abrasives in Glass Polishing

摘要

Novel composite abrasives and epoxy resin polishing pads were developed to reduce the use of cerium oxide abrasives in glass polishing. The poIymer-CeO_2 composite abrasive has a core-shell structure in which a polymer particle forms a core and a CeO_2 layer covers the polymer particle. Several polymer particles were used as core particles for the composite abrasives. The composite abrasives containing dimpled particles gave a 50% increase in removal rate compared with conventional glass polishing. In addition, we developed a novel polishing pad that uses an epoxy resin as a substitute for the conventional polyurethane resin. The removal rate of the glass surface using an epoxy polishing pad was approximately two times higher than that of a urethane polishing pad. ZrO_2 abrasives combined with the epoxy polishing pad gave a higher removal rate than the CeO_2 with a conventional urethane polishing pad, indicating that a CeO_2-free glass finishing with high polishing performance can be realized.