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Single Probe for Bare Board Continuity and Isolation Testing

机译:裸板连续性和隔离测试的单探头

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Bare board testing is vital before components loading. Defects after the PCB manufacturing processare possible such as opens, bridges, near-opens, near-bridges and characteristic impedance mismatchesdue to process variations and compounding raw material tolerances. Moreover, defects might cost aboutten times more when detected in the next test phase, another motivation for unpopulated board test isloading expensive components on a set of defective boards might be economically catastrophic. Flyingprobe systems, which were developed in late 1980's are commonly used and favorable to perform bareboard isolation and continuity testing, especially when the volume is not big enough to justify bed ofnails purchase. Flying probe system performance for a given bare board depends on the test algorithm,the mechanical speed and the number of probes. To reduce the cost on expensive test probes and probemaintenance and to accelerate the test time, this paper presents a new and cost ecient approach to testunpopulated and populated board with open sockets, using a single probe. Specically, a coaxial probeinjects one frequency signal into the PCB trace, the phase shift between the reected signal from thetrace and the incident wave is detected and compared with the nominal value, which has been capturedfrom a defect free board, which already underwent direct continuity and isolation testing. The conductedexperiments have shown a good feasibility for practical use in the ATE (Automatic Test Equipment)for bare board and loaded board with open sockets. At the highest sensitivity of the phase shift detector,the prototyped tester is capable to distinguish between a defective and error free board with signicantmargins in case of defects such as opens, DC and RF bridges, exceeded and dierent width lines. Themargin in the measurement between a defective and a correct board, which depends on the type of thedefect is about 8 % to 65 %.
机译:在加载组件之前,裸板测试至关重要。 PCB制造过程后的缺陷 有可能发生,例如开路,电桥,近开路,近电桥和特征阻抗不匹配 由于工艺变化和复合原材料公差。此外,缺陷可能会花费大约 在下一个测试阶段被检测到的检测量增加了十倍,因此进行未组装电路板测试的另一个动机是 在一组有缺陷的板上装载昂贵的组件可能在经济上造成灾难性的后果。飞行 于1980年代后期开发的测头系统是常用的并且有利于裸机 电路板隔离和连续性测试,尤其是在体积不足以证明有缺陷的情况下 指甲购买。给定裸板的飞针系统性能取决于测试算法, 机械速度和探针数量。减少昂贵的测试探针和探针的成本 维护和加快测试时间,本文提出了一种新颖且成本有效的测试方法 使用一个探针即可将未组装的和已组装好的带有开放式插座的电路板。特别是同轴探针 将一个频率信号注入PCB迹线,重新之间的相移 从 跟踪并检测入射波,并将其与已捕获的标称值进行比较 从已经进行了直接连续性和隔离测试的无缺陷电路板中提取。进行 实验显示了在ATE(自动测试设备)中实际使用的良好可行性 用于裸板​​和带有开放式插座的装载板。在相移检测器的最高灵敏度下, 原型测试仪能够区分有缺陷的电路板和无缺陷的电路板 在出现缺陷(例如开路,DC和RF桥,超出和不同宽度的线)的情况下的余量。这 有缺陷的板与正确的板之间的测量余量,取决于板的类型 缺陷约为8%至65%。

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