PROCESS DEVELOPMENT FOR HETEROJUNCTION IBC CELLS ON THIN SILICON FOILS BONDED TO GLASS

摘要

We describe the process for fabricating interdigitated back-contacted cells compatible with thin (40μm) monocrystalline silicon foils. Throughout the process, the foils are supported by either the silicon parent substrate, or by a host (glass) superstate using adhesive bonding. For a number of process steps, we describe possible issues, boundary conditions and performance. Using the integrated process which is fully compatible with bonded foils, cells were fabricated on a freestanding, non-textured wafer. An efficiency of 18.0% was achieved, the main limitations being the absence of surface texturing and a non-optimized amorphous silicon emitter.