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AN OVERVIEW OF DEVELOPMENTS IN FOIL-BASED BACK-CONTACT MODULES

机译:基于箔的背面模块的开发概述

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Back-contact modules made using a conductive back-sheet foil have a number of advantages over conventional H-pattern modules including a higher power output, compatibility with very thin cells and efficient and high yield manufacturing. In this paper, we present the results of efficiency and material optimisation for cost reduction when using metal-wrap-through (MWT) cells. This includes the use of an aluminium conductive back-sheet, a thinner encapsulant for reduced conductive adhesive consumption and an increased number of vias in the cell. Experimental and modelling results show that the cell and module performance can be improved at a reduced module costs (4% lower than current cost of MWT modules) whilst retaining reliability.
机译:使用导电背板箔制造的背触点模块具有与传统的H形图案模块相比,包括更高功率输出,与非常薄的细胞的兼容性和高产制造的相容性。在本文中,我们在使用金属包装(MWT)细胞时,介绍了降低成本降低的效率和材料优化的结果。这包括使用铝导电背板,较薄的密封剂,用于降低导电粘合剂消耗和细胞中的孔数量增加。实验和建模结果表明,在保持可靠性的同时,可以以降低的模块成本(低于MWT模块的当前成本4%,细胞和模块性能。

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