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Studies on the thermodynamic and the miscibility gap of the Cu_2O-AI_2O_3-SiO_2 pseudo-ternary system

机译:Cu_2O-Al_2O_3-SiO_2拟三元体系的热力学和混溶间隙的研究。

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Cu_2O-Al_2O_3-SiO_2 ternary system of given compositions can be used as a kind of thermal shock resistance sealing materials for electronic devices. So far, little systematic work was reported on the phase behavior and phase equilibrium at a high temperature, except the isothermal section of a CuO-Al_2O_3-SiO_2 ternary system at 950 and 1150 °C. We have investigated the thermodynamic behavior and the microstructure of the compositions in the miscibility gap of the Cu_2O-Al_2O_3-SiO_2 pseudo-ternary system on the basis of the reported isothermal section of this system at 1150°C based on the analyzing of the differential scanning calorimeter and the observing of the scanning electronic microscope. The eutectic point of the Cu_2O-Al_2O_3-SiO_2 pseudo-ternary system was determined by the thermal analysis. Then, the changing rule of the microstructures with different compositions was investigated. The results indicated that large differences existed among the different compositions in the miscibility gap of Cu_2O-Al_2O_3-SiO_2 ternary system.
机译:给定组成的Cu_2O-Al_2O_3-SiO_2三元体系可作为一种电子器件的耐热冲击密封材料。到目前为止,除了在950和1150°C下的CuO-Al_2O_3-SiO_2三元体系的等温截面外,几乎没有关于高温下的相行为和相平衡的系统工作的报道。根据差示扫描量热法的分析,基于该系统在1150°C的等温截面,我们研究了Cu_2O-Al_2O_3-SiO_2拟三元体系在混溶间隙中的热力学行为和微观结构。热量计和扫描电子显微镜的观察。通过热分析确定了Cu_2O-Al_2O_3-SiO_2伪三元体系的共晶点。然后,研究了不同组成的显微组织的变化规律。结果表明,Cu_2O-Al_2O_3-SiO_2三元体系的混溶间隙不同组成之间存在较大差异。

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